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INTEGRATED CIRCUITS
DATA SHEET
UAA2077TS 2 GHz image rejecting front-end
Preliminary specification Supersedes data of 2000 Mar 09 File under Integrated Circuits, IC17 2000 Apr 17
Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
FEATURES * Low noise, wide dynamic range amplifier * Very low noise figure * Dual balanced mixers for over 30 dB on-chip image rejection * Quadrature 200 MHz IF recombiner * On-chip quadrature network * Independent SX, RX, power-down control modes and fast power-up switching * Very small outline packaging * No image filter required, resulting in a very small application. APPLICATIONS * GSM dual band solution with UAA3522HL * High frequency front-end for DCS1800/PCS1900 portable hand-held equipment * Compact mobile digital communication equipment * Time Division Multiple Access (TDMA) receivers e.g. RF Local Area Networks (RF LANs). GENERAL DESCRIPTION The UAA2077TS contains a 2 GHz front-end receiver intended to be used in mobile telephones. Designed in an advanced BiCMOS process it combines high performance with a low power consumption and high integration, thus reducing external component costs and overall front-end size. QUICK REFERENCE DATA SYMBOL VCC ICC(pd) ICC(SRX) Tamb PARAMETER supply voltage power-down supply current supply current in SRX mode ambient temperature CONDITIONS MIN. 2.7 - - -30
UAA2077TS
The main advantage of the UAA2077TS is its ability to provide an image rejection over 30 dB. Therefore, an additional image filter between the Low Noise Amplifier (LNA) and the mixer is not required. Image rejection is achieved internally by two RF mixers in quadrature operation and two all-pass filters in the I and Q IF channels that shift the phase of signals by 45 and 135 respectively. These two phase shifted IF signals are combined and buffered to the front-end IF output signal. An input signal with a frequency above the Local Oscillator (LO) frequency results in an IF signal, while an input signal with a frequency below the LO frequency is rejected. The receive section consists of an LNA that drives a quadrature mixer pair. The IF amplifier consists of an on-chip 45 and 135 phase shifting network and an image reject IF recombiner. The IF driver has differential open-collector outputs. The LO part consists of an internal all-pass phase shifting filter to provide the quadrature LO signals for the mixers of the receive section. The all-pass filter output signals are buffered before being fed to the mixers. All RF inputs and IF outputs are balanced. Pins RXON and SXON allow control of the different active modes and power-down. The SX mode and the RX mode are independent active states of the LO section and the receive section respectively. When the logic level on pin SXON is HIGH, all internal buffers in the LO path of the circuit are turned on, thus minimizing LO pulling during the independent powering up of the receive section. Special care has been taken by design for fast switching from power-down to any of the different active modes.
TYP. 2.8 - 25 +25
MAX. 3.3 50 28 +70
UNIT V A mA C
ORDERING INFORMATION TYPE NUMBER UAA2077TS/D PACKAGE NAME SSOP16 DESCRIPTION plastic shrink small outline package; 16 leads; body width 4.4 mm VERSION SOT369-1
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
BLOCK DIAGRAM
UAA2077TS
handbook, full pagewidth
VCCLNA LNAGND 1 6
GND 9
n.c. 2, 5, 8
RXON 10 45
RFINA RFINB
3 4 LNA
x
135 IF COMBINER
15
IFA
x
RECEIVE SECTION LOCAL OSCILLATOR SECTION 135 14 45
16
IFB
VCCLO LOGND
13
QUADRATURE PHASE SHIFTER 7 SXON 11 12
UAA2077TS
FCA012
LOINB LOINA
Fig.1 Block diagram.
PINNING SYMBOL VCCLNA n.c. RFINA RFINB n.c. LNAGND SXON n.c. GND RXON LOINB LOINA VCCLO LOGND IFA IFB PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION supply voltage for receive section (LNA and IF parts) not connected RF input A (balanced) RF input B (balanced) not connected ground for receive section (LNA and IF parts) SX mode enable input (see Table 1) not connected ground RX mode enable input (see Table 1) LO input B (balanced) LO input A (balanced) supply voltage for LO section ground for LO section IF output A (balanced) IF output B (balanced) Fig.2 Pin configuration.
handbook, halfpage
VCCLNA 1 n.c. 2 RFINA 3 RFINB 4
16 IFB 15 IFA 14 LOGND
UAA2077TS
n.c. 5 LNAGND 6 SXON 7 n.c. 8
FCA011
13 VCCLO 12 LOINA 11 LOINB 10 RXON 9 GND
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
FUNCTIONAL DESCRIPTION Receive section The circuit contains a low-noise amplifier followed by two high dynamic range mixers (see Fig.3). The mixers are of the Gilbert cell type, the architecture of which is fully differential. The LO signal is phase shifted into 45 and 135 signals, mixed with the RF input signal to provide the I and Q channel signals. The I and Q channel signals are buffered, phase shifted by 45 and 135 respectively, amplified and internally combined, thus obtaining image rejection. Balanced signal interfaces are used for minimizing crosstalk from package parasitics.
UAA2077TS
The IF output is of a differential open collector type. A typical application consists of pull-up resistors of 680 at each IF output and a differential load resistance of 1 k for the IF filter, due to its impedance or its matching network. The power gain refers to the resulting power into the 1 k load. The path for the DC current from VCC into the open collector outputs should be realized by the inductors. The output signal is limited to VCC + 3VBE. Fast switching between power-down and the RX mode is controlled by the mode control pin RXON.
handbook, full pagewidth
VCCLNA LNAGND 1 6
GND 9
n.c. 2, 5, 8
RXON 10
UAA2077TS
45 3 4 LNA 135
x
IF COMBINER
15
IFA
RFINA RFINB
x
16
IFB
to LO section
FCA013
Fig.3 Receive section.
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
Local oscillator section The LO input directly drives the two internal all-pass networks to provide the quadrature signals for the mixers (see Fig.4). The SX mode (see Table 1) is used to activate the LO section, thus minimizing pulling of the external Voltage Controlled Oscillator (VCO) when enabling the receive section. The SX mode is active when the logic level on pin SXON is HIGH. Table 1 Operating modes MODE PIN RXON PIN SXON LOW HIGH LOW HIGH LOW LOW HIGH HIGH Power-down mode RX mode; receive section active SX mode; LO section active SRX mode; both sections active
GND 9 7 SXON 11
handbook, halfpage
UAA2077TS
to receive section
VCCLO LOGND
13 14 135 45
UAA2077TS
QUADRATURE PHASE SHIFTER 12
FCA014
LOGIC LEVEL
LOINB LOINA
Fig.4 LO section.
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC VSS Pi(max) Tj(max) Ptot Tstg HANDLING All pins withstand 1500 V ESD test in accordance with "MIL-STD-883C class 1 (method 3015.5)". THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air supply voltage difference in voltage between ground pins maximum input power maximum junction temperature total power dissipation storage temperature in free air PARAMETER CONDITIONS - - - - - -65 MIN.
UAA2077TS
MAX. 6 0.6 20 +150 250 +150 V V
UNIT
dBm C mW C
VALUE 120
UNIT K/W
DC CHARACTERISTICS VCC = 2.8 V; Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VCC ICC(pd) ICC(RX) ICC(SX) ICC(SRX) VIH VIL IIH IIL supply voltage power-down supply current supply current in RX mode supply current in SX mode supply current in SRX mode full temperature range 2.7 - - - - 1.9 -0.3 -1 -1 2.8 - 22 3 25 - - - - 3.3 50 24 4 28 V A mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Mode control: pins RXON and SXON HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current VCC +0.6 +1 +1 V V A A
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
AC CHARACTERISTICS VCC = 2.8 V; Tamb = 25 C; fo(RX) = 200 MHz; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - -
UAA2077TS
TYP. MAX. - - pF
UNIT
Receive section (receive section enabled): DCS mode Ri(RX) Ci(RX) RF input resistance (real part of the parallel input impedance) balanced; at 1845 MHz 50 0.5
RF input capacitance (imaginary balanced; at 1845 MHz part of the parallel input impedance) RF input frequency return loss on matched RF input balanced; note 1 conversion power gain gain ripple as a function of RF frequency gain variation with temperature 1 dB compression point input referred 3 dB desensitisation 3rd order intercept point overall noise figure referenced to RF input; note 1 interferer frequency offset is 3 MHz; useful signal is -101 dBm; note 1 referenced to RF input; note 1 RF inputs to IF outputs; note 1 normal case RF inputs to IF outputs; note 1 over DCS frequency range; note 1
fi(RX) RLi(RX) GCP(RX) Grip G/T CP1RX DES3
1805 - 10 20 - -60 -25 15 23 -1 -30 -
1880 MHz - 26 -1.5 - - - dB dB dB/100 MHz mdB/K dBm dBm
-23.5 -20
IP3RX NFRX
-15 -
-12 3.5 -
- 4.2 4.4
dBm dB dB dB MHz dB
worse case for LO input, power - and VCC ZL(RX) RLo(RX) fo(RX) IR typical application IF output load impedance IF frequency range rejection of image frequency balanced; note 1 - 10 - 30
1000 - 15 200 38 - - -
return loss on matched IF output note 1 fRF > fLO fRF > fLO; fRF is the frequency of the wanted signal; note 1
Receive section (receive section enabled): PCS mode Ri(RX) Ci(RX) RF input resistance (real part of the parallel input impedance) balanced; at 1960 MHz - - tbf tbf - - pF
RF input capacitance (imaginary balanced; at 1960 MHz part of the parallel input impedance) RF input frequency return loss on matched RF input balanced; note 1 conversion power gain gain ripple as a function of RF frequency gain variation with temperature 1 dB compression point referenced to RF input; note 1 RF inputs to IF outputs; note 1 over PCS frequency range; note 1
fi(RX) RLi(RX) GCP(RX) Grip G/T CP1RX
1930 - 10 - - - - 15 22 -1 -30 -20
1990 MHz - - - - - dB dB dB/100 MHz mdB/K dBm
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
UAA2077TS
SYMBOL DES3
PARAMETER input referred 3 dB desensitisation 3rd order intercept point overall noise figure typical application IF output load impedance IF frequency range rejection of image frequency
CONDITIONS interferer frequency offset is 3 MHz; useful signal is -101 dBm; note 1 referenced to RF input; note 1 R inputs to IF outputs; note 1 balanced; note 1
MIN. -
TYP. MAX. tbf -
UNIT dBm
IP3RX NFRX ZL(RX) RLo(RX) fo(RX) IR
- - - 10 - -
-12 3.7
- -
dBm dB dB MHz dB
1000 - 15 200 38 - - -
return loss on matched IF output note 1 fRF > fLO fRF > fLO; fRF is the frequency of the wanted signal; note 1
Local oscillator section (receive section enabled) fi(LO) Ri(LO) Ci(LO) LO input frequency LO input resistance (real part of the parallel input impedance) balanced; at 1645 MHz 1605 - - - 50 1.2 1790 MHz - - pF
LO input capacitance (imaginary balanced; at 1645 MHz part of the parallel input impedance) return loss on matched input (including standby mode) LO power level reverse isolation note 1 note 1 pins LOIN to RFIN at LO frequency; note 1
RLi(LO) Pi(LO) RI(LO) Timing tstu Notes
10 -10 40
15 -3 -
- 0 -
dB dBm dB
start-up time of each block
1
5
20
s
1. Measured and guaranteed only on demonstration board including PCB and balun.
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
PACKAGE OUTLINE SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
UAA2077TS
SOT369-1
D
E
A X
c y HE vM A
Z
16
9
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0.00 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.25 0.13 D (1) 5.30 5.10 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT369-1 REFERENCES IEC JEDEC MO-152 EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 99-12-27
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
UAA2077TS
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
Suitability of surface mount IC packages for wave and reflow soldering methods
UAA2077TS
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
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Preliminary specification
2 GHz image rejecting front-end
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
UAA2077TS
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Preliminary specification
2 GHz image rejecting front-end
NOTES
UAA2077TS
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Preliminary specification
2 GHz image rejecting front-end
NOTES
UAA2077TS
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Philips Semiconductors
Preliminary specification
2 GHz image rejecting front-end
NOTES
UAA2077TS
2000 Apr 17
15
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
403506/02/pp16
Date of release: 2000
Apr 17
Document order number:
9397 750 07033

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